Co-simulation and co-design of chip-package-board interfaces in highly-integrated RF systems

Abstract

The level of integration for RF and mm-wave systems is continuously increasing. Highly-integrated system on chip solutions have to be encapsulated in a package and assembled on a board. In addition, to be more attractive as a product, the trend goes towards further integration of passives and antennas in a package. This drives the system in package solutions. However, electrical properties of the package and board may have a significant effect on system parameters, especially at high frequencies. Hence, layout features of package and board must be carefully modelled and considered during the design. Furthermore, it is often insufficient to model chip, package and board separately, as some high-frequency effects may not be captured. An example is electromagnetic coupling between integrated coils on chip and routing traces in package. In this paper we describe considerations on co-simulation and co-design of highly-integrated RF systems by means of accurate electromagnetic modelling. We demonstrate the approach and various aspects of chip-package-board co-design based on examples of systems for various applications: 6 GHz VCO using embedded inductor; backhaul communication system in package for V-band and E-band and a four-channel 77 GHz automotive radar transceiver in a package with four dipole antennas.