On-chip UWB phased arrays for mmW connectivity

Abstract

We present a multilayer mmW phased array topology that can be lithographically fabricated above transceiver substrates. The ultra-wideband array exhibits continuous impedance bandwidth of 35-70GHz and is isolated from the lossy substrate with a ground plane. As such, the total efficiency of the array is over 60% over the entire impedance bandwidth. Perhaps more importantly, the overall height of the structure is less than 500μm, having a footprint of 7mm×3mm on the wafer, making it ideal for conformal and mobile applications for next-generation wireless systems.