Simulation on the encapsulation effect of the high-g shock MEMS accelerometer

Abstract

The modal and the response during acceleration of high-g shock MEMS accelerometer were simulated using finite element method based on a practical packaging model. The modal frequency of the packaging structure increases with the Young's modulus of encapsulation resin. But the modal-frequency may be smaller then that of the packaging structure without encapsulation if the encapsulation resin is very soft. Under the 100 kG acceleration (1 G = 9.8 m/s/sup 2/), the simulated output voltage of accelerometer decreases slowly with the increase of Young's modulus or density of encapsulation resin. The simulated output voltages are close to the analytic results. They are also linear with the environmental accelerations.