Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation - Concepedia

Concepedia

Publication | Open Access

Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

DOI Full Paper Access

43

Citations

22

References

2016

Year

Chenhuinan Wei, Guoxing Wu, Sanjun Yang, Qiming Liu

Scientific Reports

References

	Year	Citations

Page 1