Facile synthesis and electrical performance of silica-coated copper powder for copper electronic pastes on low temperature co-fired ceramic

Direct coating of gold nanoparticles with silica by a seeded polymerization technique

Eiichi Mine, Akira Yamada, Yoshio Kobayashi et al. · Journal of Colloid and Interface Science · 2003 · 192 citations

Materials Science, Nanoparticles, Chemical Engineering +9

Control of shell thickness in silica-coating of Au nanoparticles and their X-ray imaging properties

Yoshio Kobayashi, Hiromitsu Inose, Tomohiko Nakagawa et al. · Journal of Colloid and Interface Science · 2011 · 74 citations

Materials Science, Engineering, X-ray Imaging Properties +9

Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

Yonggang Wang, Guangneng Zhang, Jusheng Ma · Materials Science and Engineering B · 2002 · 74 citations

Materials Science, Electrical Engineering, Engineering +5

Preparation of ultra fine copper–nickel bimetallic powders for conductive thick film

Songping Wu, Jiao Li, Ni Jing et al. · Intermetallics · 2007 · 47 citations

Materials Engineering, Materials Science, Chemical Engineering +7

Sinterability and conductivity of silver paste with Pb-free frit

Dong Seok Seo, S.H. Park, J.K. Lee · Current Applied Physics · 2008 · 41 citations

Materials Engineering, Materials Science, Engineering +3