Paper-Based Inkjet-Printed Flexible Electronic Circuits

TLDR

Printed flexible electronics are widely studied for their potential in diverse applications. The paper demonstrates a simple, low-cost method for fabricating flexible electronic circuits with high conductivity (~70% of bulk copper). The method uses stannous chloride‑treated Teslin paper, inkjet‑printed catalyst ink, and low‑temperature electroless copper deposition. The resulting circuits retain functionality under folding and show promise for 3D devices and disposable RFID tags, despite some conductance loss.

Abstract

Printed flexible electronics have been widely studied for their potential use in various applications. In this paper, a simple, low-cost method of fabricating flexible electronic circuits with high conductivity of 4.0 × 107 S·m–1 (about 70% of the conductivity of bulk copper) is demonstrated. Teslin paper substrate is treated with stannous chloride (SnCl2) colloidal solution to reduce the high ink absorption rate, and then the catalyst ink is inkjet-printed on its surface, followed by electroless deposition of copper at low temperature. In spite of the decrease in conductance to some extent, electronic circuits fabricated by this method can maintain function even under various folding angles or after repeated folding. This developed technology has great potential in a variety of applications, such as three-dimensional devices and disposable RFID tags.