Concepedia

Publication | Closed Access

Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode

DOI

15

Citations

16

References

2016

Year

Y. C. Lin, K. T. Lee, Jenn-Dong Hwang, H. S. Chu, Chia-Cheng Hsu, Shihui Chen, Tung‐Han Chuang
Journal of Electronic Materials

References

YearCitations

Page 1