Publication | Closed Access
Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing
27
Citations
8
References
2012
Year
Materials EngineeringMaterials ScienceSn-based SolderEngineeringSevere Plastic DeformationCorrosionApplied PhysicsMetallurgical InteractionMetallurgical ProcessElectronic PackagingMetal FormingSn Grain OrientationMicrostructureMetal ProcessingCu6sn5 Formation
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