Sub-Millimeter and Terahertz-Wave Packaging for Large Chip-Width MMICs

Abstract

We present novel waveguide packaging for sub-millimeter and terahertz-wave devices, which is suitable for large chip-width MMICs and doesn't require any additional fabrication process. With full electromagnetic simulation, we analyze possible wave modes in a rectangular waveguide with thin E-plane slits formed for inserting large-width MMICs into the split waveguide block and show that parasitic modes can be well suppressed by lossy and high-dielectric material. For a 1.1-mm-wide test IC in the 260-320 GHz band, measured transition loss is around 1 dB with more than 60 dB inter-port isolation.