Ultrastiff Biobased Epoxy Resin with High <i>T</i>_g and Low Permittivity: From Synthesis to Properties

Abstract

Harvesting biobased epoxy resins with improved thermomechanical properties (e.g., glass transition temperature Tg and storage modulus), mechanical and dielectric similar and even superior to that of bisphenol A epoxy resin (DGEBA) is vital to many applications, yet remains a substantial challenge. Here we develop a novel eugenol-based epoxy monomer (TEU-EP) with a branched topology and a very rich biobased retention (80 wt %). TEU-EP can be well cured by 3,3′-diaminodiphenyl sulfone (33DDS) and the resultant TEU-EP/33DDS system can be considered as a “single” epoxy component, exhibiting adequate reactivity at high processing temperatures. Importantly, compared with DGEBA/33DDS, TEU-EP/33DDS achieves a 33 °C, 39% and 55% increment in the glass transition temperature, Young’s modulus, and hardness, respectively, and shows the improved creep resistance and dimensional stability. TEU-EP/33DDS is also characterized by the considerably reduced permittivity, dielectric loss factor, and flammability with high yield of pyrolytic residual. Overall, TEU-EP endows the cured epoxy with a number of the distinguished properties outperforming its DGEBA counterpart, and therefore may find practical applications in demanding and even cutting-edge areas.