The bonding of nanowire assemblies using adhesive and solder - Concepedia

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The bonding of nanowire assemblies using adhesive and solder

41

Citations

38

References

2005

Year

Zhiyong Gu, Hongke Ye, David H. Gracias, David H. Gracias

Materials ScienceNanoscale SystemEngineeringNanomaterialsNanotechnologyNanostructure SynthesisElectronic PackagingNanowire Assemblies

References

	Year	Citations

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