Journal of Sandwich Structures & Materials · 2014 · 49 citations · 30 references
EngineeringMechanical EngineeringActuatorsHeat TransferThermal AnalysisPiezoelectric ActuationPiezoelectric ActuatorsPiezoelectric MaterialsPlate TheoryThermal Expansion AnalysisThermal StressesBuckling Of Circular PlatesBuckling Under Thermal LoadLinear StabilityThermal BucklingThermal Buckling AnalysisThermal ExpansionThermal Expansion CoefficientThermal Stability
This study presents the thermal buckling analysis of solid circular plate made of porous material bounded with piezoelectric sensor-actuator patches. The porous material properties vary through the thickness with specific function. The general mechanical nonlinear equilibrium and linear stability equations are derived using the variational formulations to obtain the governing equations of piezoelectric porous plate. Thermal buckling load is derived for solid circular plates under uniform temperature load for the clamped edge condition. In recent paper the effects of porous plate’s thickness, porosity, porous thermal expansion coefficient, piezoelectric thickness, piezoelectric thermal expansion coefficient, and feedback gain on thermal stability of the plate are investigated.
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Buckling of Bars, Plates, and Shells
D. O. BRUSH, B. O. Almroth, John W. Hutchinson · Journal of Applied Mechanics · 1975 · 1.7K citations · Full text
Thermal Buckling of Functionally Graded Plates
R. Javaheri, M. R. Eslami · AIAA Journal · 2002 · 426 citations