Concepedia

Publication | Closed Access

Lightweight Polypropylene/Stainless-Steel Fiber Composite Foams with Low Percolation for Efficient Electromagnetic Interference Shielding

330

Citations

61

References

2014

Year

TLDR

The study investigates how microstructure influences properties and examines the mechanism behind EMI shielding enhancement. PP‑SSF composites were fabricated via foam injection molding with CO₂ plasticizer, yielding long, well‑dispersed fibers (aspect ratio > 100) and enabling measurement of percolation, conductivity, and EMI shielding. The composites achieved a 75 % lower percolation threshold (0.21 vol %) and a maximum specific EMI shielding effectiveness of 75 dB·g⁻¹·cm³, surpassing solid counterparts.

Abstract

Lightweight polypropylene/stainless-steel fiber (PP-SSF) composites with 15-35% density reduction were fabricated using foam injection molding. The electrical percolation threshold, through-plane electrical conductivity, and electromagnetic interference (EMI) shielding effectiveness (SE) of the PP-SSF composite foams were characterized and compared against the solid counterparts. With 3 wt % CO2 dissolved in PP as a temporary plasticizer and lubricant, the fiber breakage was significantly decreased during injection molding, and well-dispersed fibers with unprecedentedly large aspect ratios of over 100 were achieved. The percolation threshold was dramatically decreased from 0.85 to 0.21 vol %, accounting for 75% reduction, which is highly superior, compared to 28% reduction of the previous PP-carbon fiber composite foam.1 Unlike the case of carbon fiber,1 SSFs were much longer than the cell size, and the percolation threshold reduction of PP-SSF composite foams was thus primarily governed by the decreased fiber breakage instead of fiber orientation. The specific EMI SE was also significantly enhanced. A maximum specific EMI SE of 75 dB·g(-1)·cm(3) was achieved in PP-1.1 vol % SSF composite foams, which was much higher than that of the solid counterpart. Also, the relationships between the microstructure and properties were discussed. The mechanism of EMI shielding enhancement was also studied.

References

YearCitations

Page 1