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The Effects of Void Ratio in Die Attach Layer on Optical and Thermal Performances of High Power Light Emitting Diode

White OledPhotonicsElectrical EngineeringOptical MaterialsEngineeringSolid-state LightingPhotoluminescenceOptical PropertiesApplied PhysicsNew Lighting TechnologyVoid RatioDie Attach LayerElectronic PackagingThermal PerformancesMicroelectronicsOptoelectronicsCompound Semiconductor