Compact THz LTCC Receiver Module for 300 GHz Wireless Communications

Abstract

A compact, low-cost, fully-integrated package solution has been developed for 300 GHz short-range communication systems. Using low-temperature co-fired ceramic (LTCC) technology, an integrated reflector for the on-chip antenna and high-data-rate signal interconnections including a flip-chip and via transition are embedded in a package. A reduced-size silicon lens antenna is placed in a package cavity together with a flip-chip bonded receiver IC with an on-chip antenna. The overall size of the front-end receiver is only 10 × 10 × 4 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> , including the 6 mm diameter silicon lens. This compact terahertz receiver, mounted on an evaluation board, demonstrated wireless links with data rates up to 27Gb/s.