Integrated motor drives: state of the art and future trends

TLDR

Integrated motor drives (IMD) offer a potential solution for high power density, high efficiency, and high temperature demands in aerospace and automotive applications, but close integration of converter and machine can raise component temperatures. This study reviews existing IMD technologies and their thermal effects on the IMD system. The authors analyze mechanical, structural, and thermal aspects of IMD design, investigate the influence of power electronics placement and thermal management concepts, review converter topologies such as matrix, two‑level bridge, three‑level neutral‑point clamped, and multiphase full‑bridge, and discuss wide‑bandgap devices and power‑module packaging technologies. The review identifies design and manufacturing challenges, mechanical and structural impacts of close integration, and proposes potential solutions.

Abstract

With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two‐level bridge, three‐level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented.