Publication | Closed Access
High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding
220
Citations
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References
2016
Year
Materials ScienceMaterials EngineeringHigh StrengthEngineeringMicrofabricationNanotechnologyNanomaterialsMechanical EngineeringApplied PhysicsPrinted ElectronicsHigh-performance MaterialElectronic PackagingThermal StabilityNanoarchitectonics
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