Nanofluids Heat Transfer Performance for Cooling of High Heat Output Microprocessor

Abstract

The heat transfer performance of two nanofluids, namely water-γAl2O3 and Ethylene Glycol- γAl2O3, for cooling of high heat output microprocessors has been numerically investigated. Results have shown that with an increase of particle volume concentration and/or the flow Reynolds number, the heat transfer coefficient has considerably augmented, which results in a significant decrease of the maximum junction temperature. The combination of such use of nanofluids and the turbulent flow regime has been found particular advantageous as it can give very low level of junction temperature.