Optimization of Sensor Introduction into Laminated Composites

Abstract

The integration of sensors, actuators, and such devices into a structure is vital in smart applications. Essential to the application of smart composites is the issue of the mechanical coupling of the sensor to the host material. Here we present various methods of embedding sensors within the host composite material. In this study, quasistatic three-point bending (short beam) and fatigue three-point bending (short beam) tests are conducted in order to characterize the effects of introducing the sensors or suitable simulated sensors into the host composite material. The sensors that are examined include simulated sensors in the form of chip resistors with the original packaging geometry and polyvinylidene fluoride thin film sensors (PVDF). The methods of sensor integration include placement between the layers of prepreg material as well as placement within precision punched cut-outs of the prepreg material. Therefore, the battery of tests on the various configurations allows us to determine the technique that optimizes the mechanical properties of the host composite material. BACKGROUND