Rare & Special e-Zone (The Hong Kong University of Science and Technology) · 2001 · 10 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials CharacterizationMechanical Behavior Of MaterialsAlloysMechanical CharacterizationStrain HardeningStrain Rate EffectsStress-strain BehaviorWork HardeningRate-dependent Material BehaviorSolderingStrain Hardening RateStrain Rate HardeningTime-dependent Strain
A novel punch shear testing method is introduced in this study to investigate the strain rate-dependent shear behavior of solder materials. Both static and dynamic shear strengths of 63 Sn-37Pb solder were characterized. The experimental results indicate that the shear response of solder alloy is very sensitive to the strain rate and the dynamic shear strength is much higher than the static one. Besides, the localized crack band was found in the dynamic punch shear tests. This phenomenon reveals that the adiabatic shear localization should be a significant mechanism for controlling the mechanical behavior of 63Sn-37Pb solder alloy under dynamic shear loading.