Publication | Closed Access

Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

Materials ScienceFriction WeldingEngineeringSevere Plastic DeformationMechanical EngineeringApplied PhysicsSn-3ag-0.5cu Solder JointsSolid MechanicsJoint Scale3D PrintingMicrostructure-strength RelationshipManufacturing EngineeringElectronic PackagingMechanics Of MaterialsMicrostructureMetal Processing