Mechanical Properties of Porcelain with Thermally and Chemically Induced Residual Stress on Glaze

Abstract

In this study, we measured the thermally and chemically induced residual stresses on glaze using the photoelastic method. Porcelain with thermally induced residual stress showed compressive stress of 49 MPa for thermal expansion mismatch and a locally fluctuated stress field over the glaze layer due to compensation of compressive stresses around pores. In the case of chemically strengthened porcelain, the compressive stress on the glaze was 151 MPa which was around 3 times higher than the stress on thermally strengthened glaze. The trend of fracture strength of thermally and chemically strengthened porcelains was coincident with that of the residual stress of porcelains.