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730 mV implied Voc enabled by tunnel oxide passivated contact with PECVD grown and crystallized n+ polycrystalline Si
23
Citations
18
References
2015
Year
Unknown Venue
Materials EngineeringMaterials ScienceSemiconductorsSemiconductor DeviceEngineeringPerovskite Solar CellTunnel OxideSolar Cell StructuresApplied PhysicsDeposition PowerSemiconductor MaterialSemiconductor Device FabricationOptoelectronic DevicesSilicon On InsulatorPhotovoltaicsHighest Implied VocPecvd GrownSolar Cell Materials
This paper presents the fabrication and optimization of tunnel oxide passivated contact with crystallized n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> polycrystalline Si (poly-Si) for high-efficiency large-area n-type front-junction Si solar cells. Starting with a baseline process, we optimized (a) the PECVD deposition precursor SiH <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> /PH <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> flow rate, (b) the H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> gas volume ratio, (c) the crystallization annealing temperature, (d) the tunnel oxide growth temperature, and (e) the deposition power to achieve the highest implied Voc. This resulted in an implied V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">oc</sub> of 730 mV, J <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ob</sub> ' of 4.3 fA/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , and implied fill factor (FF) of >84.5% with symmetric structure on n-type Cz substrate (~4 Ωcm, 170μm), indicating excellent interface passivation quality of tunnel oxide/n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> poly-Si contact. Applying a high dose ion-implanted boron emitter passivated with Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> and screen-printed and fired Ag/Al front contact, 21.2% cell efficiency was achieved on 239 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> commercial grade n-type Cz wafers.
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