EngineeringMaterials EngineeringMaterials ScienceMetallurgySurface EngineeringSurface ScienceCoating ProcessesCoating TechnologySurface CoatingsSurface ModificationSurface PassivationSurface TreatmentBarrier Layer DepositionBarrier Layer FormationCompressive LoadsIntermetallic Compound FormationIntermetallic FormationMitigation StrategiesRisk Mitigation StrategiesThickness Control
Introduction 1 Risks Related To Tin Whiskers 2 A Brief Description Of Tin Whiskers 2 Tin Whisker Growth Mechanism 2 Mitigation Strategies 3 Avoid Tin Plated Parts 4 Strip and Replate 5 Solder Dip the Plated Surfaces Sufficiently Using a Tin-Lead Solder 5 Select a Matte or Low Stress Tin Finish 6 Select Underplating (Barrier layer) to Reduce Intermetallic Formation 6 Vary Thickness of Tin Plating 6 Annealing 7 Avoid Applying Compressive Loads on Plated Surfaces 8 Apply a Conformal Coat 8 Evaluate Application Specific Risks 10 Summary and Conclusions 10 References 10 Document Development Details 11
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TIN WHISKERS: ATTRIBUTES AND MITIGATION
Jay Brusse, Gary J. Ewell, Jocelyn P. Siplon · 2002 · 66 citations
Natural Sciences, Materials Engineering, Materials Science +17
M.E. McDowell · 2002 · 24 citations · Full text