Publication | Open Access

Microstructure evolution and mechanical properties of transient liquid phase bonded Ti–6Al–4V joint with copper interlayer

Materials EngineeringMaterials ScienceEngineeringMechanical PropertiesMaterial PropertyMechanical EngineeringCopper InterlayerMaterial InnovationInterfacial PhenomenaMicrostructure EvolutionHigh-performance MaterialTransient Liquid PhaseInterface PropertyMicrostructure