IEEE Journal of Emerging and Selected Topics in Power Electronics · 2014 · 74 citations · 32 references
EngineeringAutomotive EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsSemiconductor DevicesConverter TopologiesElectric DrivesElectric Motor DrivesElectric Vehicle ElectronicsPower Electronics For Electric VehiclesSemiconductor Device MaterialsEnergy Conversion EfficiencyInsulated-gate Field-effect TransistorsPower Electronics IntegrationSilicon CarbideSilicon Carbide Power DevicesSilicon Carbide Power ElectronicsTotal Harmonic Distortion ReductionVoltage Harmonic Distortion
Voltage sourced converters (VSCs) in electric vehicle (EV) drive-trains are conventionally implemented by silicon Insulated Gate Bipolar Transistors (IGBTs) and p-i-n diodes. The emergence of SiC unipolar technologies opens up new avenues for power integration and energy conversion efficiency. This paper presents a comparative analysis between 1.2-kV SiC MOSFET/Schottky diodes and silicon IGBT/p-i-n diode technologies for EV drive-train performance. The switching performances of devices have been tested between -75 °C and 175 °C at different switching speeds modulated by a range of gate resistances. The temperature impact on the electromagnetic oscillations in SiC technologies and reverse recovery in silicon bipolar technologies is analyzed, showing improvements with increasing temperature in SiC unipolar devices whereas those of the silicon-bipolar technologies deteriorate. The measurements are used in an EV drive-train model as a three-level neutral point clamped VSC connected to an electric machine where the temperature performance, conversion efficiency and the total harmonic distortion is studied. At a given switching frequency, the SiC unipolar technologies outperform silicon bipolar technologies showing an average of 80% reduction in switching losses, 70% reduction in operating temperature and enhanced conversion efficiency. These performance enhancements can enable lighter cooling and more compact vehicle systems.
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J. Biela, Mario Schweizer, S. Waffler et al. · IEEE Transactions on Industrial Electronics · 2010 · 863 citations · Full text
Souleman Njoya Motapon, Louis‐A. Dessaint, Kamal Al‐Haddad · IEEE Transactions on Industrial Electronics · 2013 · 534 citations
Engineering, Aerospace Engineering, Electrical Engineering +17
Gianmario Pellegrino, Alfredo Vagati, Paolo Guglielmi et al. · IEEE Transactions on Industrial Electronics · 2011 · 501 citations · Full text
Engineering, Automotive Engineering, Electrical Engineering +17