Integrated micro heat sink for power multichip module

Abstract

Today, more and more compact converters with high current are required. The thermal environment is a key point to meet these requirements: the heat sink must be integrated as closely as possible to heat sources. Liquid-cooled microchannel heat sinks are very efficient and well adapted to the cooling of power components. Thus, a high-performance micro heat sink was made and tested under a power multichip module. First, the principle of the microchannel heat sink and a three-dimensional approach are presented. Then, a prototype and results are described. Composed of eight insulated gate bipolar transistor chips, the prototype has a current rating as high as 1200 A.