Publication | Closed Access
Block Copolymer Thin Films: Physics and Applications
897
Citations
149
References
2001
Year
Materials ScienceBoundary Condition SymmetryThin Film PhysicsBlock Co-polymersEngineeringFilm ThicknessPolymer ScienceApplied PhysicsSurface ScienceLiquid Crystalline ElastomerThin Film MaterialsThin Film Process TechnologyThin FilmsPolymer Self-assemblyPolymer ChemistryBlock Copolymer FilmsThin Film ProcessingPolymers
Film thickness and surface energetics critically influence the morphology of symmetric diblock copolymer thin films, while asymmetric systems, liquid‑crystalline, and triblock architectures introduce additional structural complexity. The review seeks to consolidate research on block copolymer thin films, covering both fundamental physics and technological applications. The review examines experimental and theoretical studies of the forces shaping film morphology and discusses strategies—such as thickness control, surface chemistry, external fields, and patterned substrates—to manipulate microphase domain order for applications like lithography and photonics.
▪ Abstract A two-part review of research concerning block copolymer thin films is presented. The first section summarizes experimental and theoretical studies of the fundamental physics of these systems, concentrating upon the forces that govern film morphology. The role of film thickness and surface energetics on the morphology of compositionally symmetric, amorphous diblock copolymer films is emphasized, including considerations of boundary condition symmetry, so-called hybrid structures, and surface chemical expression. Discussions of compositionally asymmetric systems and emerging research areas, e.g., liquid-crystalline and A-B-C triblock systems, are also included. In the second section, technological applications of block copolymer films, e.g., as lithographic masks and photonic materials, are considered. Particular attention is paid to means by which microphase domain order and orientation can be controlled, including exploitation of thickness and surface effects, the application of external fields, and the use of patterned substrates.
| Year | Citations | |
|---|---|---|
Page 1
Page 1