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Achievement of a high channel strain via dry oxidation of recessed source/drain Si1−xGex structures
12
Citations
8
References
2011
Year
Materials EngineeringMaterials ScienceEpitaxial GrowthSemiconductor DeviceEngineeringChannel StrainNanoelectronicsApplied PhysicsDry OxidationSemiconductor Device FabricationMolecular Beam EpitaxySilicon On InsulatorMicroelectronicsNanobeam DiffractionHigh Channel Strain
This study proposes a method of acquiring a high channel strain by locally oxidizing recessed Si1−xGex source/drain structures and forming a Ge condensation layer as an effective stressor. Combination of several transmission electron microscopy characterization techniques including nanobeam diffraction allowed us to analyze the thickness and composition of the Ge condensation layer formed upon oxidation, and the evolution of the channel strain. Nanobeam diffraction results demonstrate that this method can be critically used to effectively increase the channel strain.
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