IEEE Transactions on Antennas and Propagation · 2011 · 54 citations · 21 references
EngineeringElectrical EngineeringAntennasMicrowave EngineeringWireless CommunicationsAntenna ArraysAntenna DesignMicrowave AntennasMicrowave Integrated CircuitsPlanar AntennasRadio-frequency Integrated CircuitsAntenna Array DesignGainIntegrated AntennasMicrowave Integrated Circuit DesignMillimeter-wave Integrated CircuitsPolarizationPolarization CharacteristicsStripline
A compact 60-GHz active receiving antenna array is designed and fabricated using low temperature co-fired ceramic (LTCC) technology. It integrates a 4 <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$\,\times\,$</tex></formula> 4 circularly polarized (CP) patch array and a 21-dB low noise amplifier (LNA) into the same package substrate. By applying a stripline sequential rotation feeding scheme the CP array exhibits a wide impedance bandwidth <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex Notation="TeX">$({\rm SWR}< 2)$</tex></formula> and 3-dB axial ratio bandwidth, both over 8 GHz, as well as a beam-shaped pattern with a 3-dB beam width of 20 <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$^{\circ}$</tex> </formula> and a peak gain of 16.8 dBi. By applying a bond wire compensation scheme and low-loss transition optimization, the LNA is successfully integrated into the package. The final fabricated prototype measures only 13 <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$\,\times\,$</tex></formula> 20 <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$\,\times\,$</tex></formula> 1.4 mm <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$^{3}$</tex></formula> , demonstrates the good integration performance as well as the CP polarization characteristics in measurement, and is estimated to have a peak overall gain of at least 35 dBi.
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Millimeter-wave performance of chip interconnections using wire bonding and flip chip
T. Krems, W.H. Haydl, H. Massler et al. · 2002 · 162 citations
Engineering, Computer Engineering, Electrical Engineering +17