Challenges in Electronic Cooling—Opportunities for Enhanced Thermal Management Techniques—Microprocessor Liquid Cooled Minichannel Heat Sink

TLDR

Increasing power density and compact packaging in computers drive a conflict between high performance demand and the limitations of air cooling, prompting consideration of alternative cooling technologies. The study examines how various factors influence cooling technology choice by analyzing two IBM server packages and presenting a liquid‑cooled minichannel heat sink for the IBM Power4 microprocessor. The authors evaluate cooling options by reviewing two IBM server packages and detailing a liquid‑cooled minichannel heat sink designed for the IBM Power4 chip. The liquid‑cooled minichannel heat sink demonstrates effective thermal performance for the IBM Power4 microprocessor.

Abstract

The volumetric heat dissipated by computer equipment at each level of the package from the chip to the chassis is having a tremendous impact on the thermal management of computer equipment. Because of the consumer's insatiable desire for increased performance, the competitive pressures are driving the computer manufacturer to pack as much processor/memory performance within the smallest volume possible. The consumer views high performance in a compact package as a benefit. These market pressures seem to be in direct conflict with the desire to continue to provide air cooling solutions for the foreseeable future. Because of these trends in power and package design, other cooling technologies beside air are now becoming viable, techniques, but each must be weighed with many other factors that influence the cooling technology selected. These factors will be discussed along with two specific IBM server packages and their associated cooling technology employed. Finally a microprocessor liquid cooled minichannel heat sink will be described and its performance presented as it applies to a current microprocessor (IBM Power4) chip.