Accurate thin film multijunction thermal converter on a silicon chip (AC-DC standard)

Abstract

The design of a planar, thin-film, multijunction thermal converter (MJTC) on a silicon chip containing a window with a SiO/sub 2/ membrane for low heat conductance underneath the thermal element is described. This design offers the possibility of mass production of MJTCs. Typical relative AC-DC transfer uncertainties of a few parts in 10/sup 6/ have been measured with CuNi44 heaters. Heater materials with lower Thomson coefficients than CuNi44 should result in uncertainties of a few parts in 10/sup 7/.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>