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Back‐channel‐etched thin‐film transistor using <i>c</i>‐axis‐aligned crystal In–Ga–Zn oxide
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Citations
19
References
2014
Year
Materials ScienceElectrical EngineeringBack‐channel‐etched Thin‐film TransistorEngineeringElectronic MaterialsClear Grain BoundaryOxide ElectronicsApplied PhysicsBack ChannelIgzo TftsThin Film Process TechnologyThin FilmsEpitaxial GrowthThin Film Processing
Abstract Our crystalline In–Ga–Zn oxide (IGZO) thin film has a c ‐axis‐aligned crystal (CAAC) structure and maintains crystallinity even on an amorphous base layer. Although the crystal has c ‐axis alignment, its a ‐axis and b ‐axis have random arrangement; moreover, a clear grain boundary is not observed. We fabricated a back‐channel‐etched thin‐film transistor (TFT) using the CAAC‐IGZO film. Using the CAAC‐IGZO film, more stable TFT characteristics, even with a short channel length, can be obtained, and the instability of the back channel, which is one of the biggest problems of IGZO TFTs, is solved. As a result, we improved the process of manufacturing back‐channel‐etched TFTs.
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