IEEE Transactions on Microwave Theory and Techniques · 1968 · 214 citations · 5 references
EngineeringElectrical EngineeringCircuit TheoryElectromagneticsMicrowave EngineeringDielectricsMicrostrip CircuitsMicrowave Network AnalysisMicrowave Transmission LinesShielding MaterialsTransmission LinesCapacitanceCharge Density AnalysisCharge DistributionMicrostrip Circuit AnalysisMicrostrip LinesMicrostrip Transmission LinesStriplineTransmission Line Analysis
These transmission lines are characterized by conducting strips, large ground planes, multi‑dielectric‑layer insulation, and planar geometry. A theoretical method is presented to analyze microstrip‑like transmission lines. The method uses a variational calculation of line capacitance in the Fourier domain with a trial charge density, yielding formulas applicable to shielded double‑layer, double‑layer, shielded, and plain microstrip lines. Calculated capacitance and guide wavelength agree with measurements, and the theory explains oxide‑layer effects on silicon and shielding effects on sapphire microstrip lines, while outlining its limitations and potential applications.
A theoretical method is presented by which microstrip-like transmission lines can be analyzed. These transmission lines are characterized by conducting strips, large ground planes, multi-dielectric-layer insulation, and planar geometry. The method is essentially based on a variational calculation of the line capacitance in the Fourier-transformed domain and on the charge density distribution as a trial function. A shielded double-layer microstrip line is analyzed by this method. Derived formulas for this structure are also applicable to simpler structures: a double-layer microstrip line, a shielded microstrip line, and a microstrip line. The calculated values of the line capacitance and the guide wavelength are compared with the measured values where possible. Oxide-layer effects on a silicon microstrip line and shielding effects on a sapphire microstrip line are also discussed based on this theory. The limitations and possible applications of this method are described.
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