A solder joint inspection system for automated printed circuit board manufacturing

Abstract

The design of a solder joint inspection system which will be used as an integral part of the PCB/AID (automated inspection and diagnosis for PC board manufacturing) system is presented. The inspection system utilizes four frames of solder joint images, extracts 15 features from the images to categorize the most important seven classes of solder joint defects, and provides two forms of inspection results according to their applications (touch-up of defects and fault diagnosis for online process control). The system has been tested for several PC boards provided by electronics firms, and experimental results have shown that it has exceptional promise.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>