Publication | Closed Access
Full-chip analysis of leakage power under process variations, including spatial correlations
218
Citations
13
References
2005
Year
Unknown Venue
EngineeringPower Optimization (Eda)Computer ArchitectureGate Tunneling LeakageLeakage PowerHardware SecurityProcess VariationsPhysical Design (Electronics)Full-chip AnalysisElectronic PackagingPower-aware DesignElectrical EngineeringHardware ReliabilityBias Temperature InstabilityComputer EngineeringTotal Chip LeakageMicroelectronicsStress-induced Leakage CurrentCircuit Reliability
In this paper, we present a method for analyzing the leakage current, and hence the leakage power, of a circuit under process parameter variations that can include spatial correlations due to intra-chip variation. A lognormal distribution is used to approximate the leakage current of each gate and the total chip leakage is determined by summing up the lognormals. In this work, Both subthreshold leakage and gate tunneling leakage are considered. The proposed method is shown to be effective in predicting the CDF/PDF of the total chip leakage. The average errors for mean and sigma values are -1.3% and -4.1%
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