High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides

Abstract

This paper describes the technical approach and progresses of the POINT (Polymer Optical Interconnect Technology) program. This project is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego (UCSD), sponsored by DARPA/ETO to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. In this paper, we describe the recent development under this program in the following areas: (a) a high density optical interconnect for board and backplane applications using polymer waveguides (Polyguide) to demonstrate high I/O density (100 /spl mu/m channel spacing) and high speed (/spl sim/1 Gbps) interconnect with an interconnect distance to 280 mm, (b) a high density and high speed VCSEL array packaging technology that employs planar and batch fabrication processes scaleable to large volume, low-cost manufacturing, (c) passive alignment techniques for reducing the recurrent cost in an optoelectronic assembly, (d) low-loss optical polymers for board and backplane level interconnects, and (e) CAD tools for modeling multimode guided wave systems and assisting optoelectronic packaging mechanical design.