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The Effect of Solution pH and Heat‐Treatment on the Properties of Electroless Nickel Boron Films
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1994
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Materials ScienceMaterials EngineeringChemical EngineeringBoron ContentDifferent TemperaturesEngineeringBoron NitrideBoron FilmsCubic Boron NitrideSurface ScienceApplied PhysicsThin FilmsThin Film ProcessingElectrochemistrySolution Ph
Electroless nickel boron films were investigated using metallizing solutions of various pH's and heat‐treatments at different temperatures. Solution pH controls the boron content in the as‐deposited films which in turn acts as a crystallization inhibitor. Heat‐treatments at different temperatures all result in the formation of face centered cubic nickel crystallites of varying dimensions and causes the migration of boron to the surface. Using radial distribution function techniques, the amount of residual stress in these films was also determined.