IEEE Transactions on Applied Superconductivity · 2010 · 741 citations · 4 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsHeat TransferPower ElectronicsElectrical ConductivityInsulation MaterialsInsulation SystemsThermal InsulationCoil DesignCurrent DensityEquivalent Circuit AnalysisEquivalent Circuit ModelingInsulation TechnologyMechanical Integrity AssessmentMechanical Integrity TestingThermal Stability
The study investigates high‑temperature superconductor pancake coils fabricated without turn‑to‑turn insulation. The authors wound three no‑insulation pancake coils—two Bi2223 (single and double) and one ReBCO single—and validated an equivalent electrical circuit model through charge‑discharge, sudden‑discharge, and overcurrent tests. The NI winding improves overall current density, thermal stability, and mechanical integrity compared to insulated coils.
This paper reports a study of HTS pancake coils without turn-to-turn insulation. Three no-insulation (NI) pancake coils were wound: each single and double pancake coil of Bi2223 conductor and one single pancake of ReBCO conductor. An equivalent electrical circuit for modeling NI coils was verified by two sets of test: 1) charge-discharge; and 2) sudden discharge. Also, an overcurrent test in which a current exceeding a coil's critical current by 2.3 times was performed, and analysed, to demonstrate that in terms of stability NI HTS coils outperform their counterparts. The new NI winding offers HTS coils enhanced performance in three key parameters: overall current density; thermal stability; and mechanical integrity.
4
A. Tollestrup · AIP conference proceedings · 1982 · 520 citations
A 1.3-GHz LTS/HTS NMR Magnet– A Progress Report
Juan Bascuñán, Seungyong Hahn, Dong Keun Park et al. · IEEE Transactions on Applied Superconductivity · 2010 · 50 citations · Full text