Wafer-scale processing, assembly, and testing of tunneling infrared detectors

Abstract

The individual assembly of early tunneling sensors required time and skill which were incompatible with high volume production and which produced a very large variation in key device operating parameters. This paper describes the first successful fully wafer-scale production of tunneling sensors. The sensors produced in this process feature noise and sensitivity characteristics consistent with the best tunneling sensors developed so far and are appropriate for use as state-of-the-art uncooled infrared detectors.