Exploiting temperature measurements for cure monitoring of FRP composites—Applications with thermocouples and infrared thermography

Abstract

The curing behavior of a fiber-reinforced polymer composite part is interesting for both the industrial and scientific community, for it is related to process optimization, quality upgrade, and material characterization. The study at hand focuses on the potential of temperature measurements as a means to monitor curing; kinetic analysis which conventionally is being done for small neat resin samples in a thermally stable environment (laboratory instruments), is in this study implemented for actual scale composite samples in an environment with significant thermal gradients (manufacturing). To ensure the success of this transition, live temperature data and kinetic parameters derived from DSC of composite samples were used as input to the kinetic equations. Process monitoring with thermocouples that was compared with dielectric constant monitoring and conventional kinetic analysis confirmed the validity of the method. An application with infrared thermography determined the impact of heat insulators within the composite (e.g. delaminations) on the superficial curing degree.