IEEE Microwave and Wireless Components Letters · 2002 · 158 citations · 9 references
EngineeringElectrical EngineeringCircuit TheoryMicroelectronicsMicrowave EngineeringImpedance MatchingImpedance Matching CircuitsMicrostrip CircuitsMicrowave AmplifiersMicrowave Integrated CircuitsMicrowave Transmission LinesDefected Ground StructuresElectrical ImpedanceImpedance Matching In Microwave CircuitsImpedance Matching NetworksInductive CouplingMicrostrip LinesMicrostrip Transmission LinesMicrowave Amplifier Design
This letter presents a new technique to reduce the size of microwave amplifiers using a defected ground structure (DGS). The DGS on the ground plane of a microstrip line provides an additional effective inductive component, which enables a microstrip line with very high impedance to be realized and shows slow-wave characteristics. The resultant electrical length of the microstrip line with DGS is longer than that of a conventional line for the same physical length. Therefore, the microstrip line with DGS can be shortened in order to maintain the same electrical length, matching, and performances of the basic (original) amplifier. To confirm the validity of this idea, two amplifiers, one of which is designed using a conventional microstrip line and the other is reduced using DGS, are fabricated, measured, and compared. The performance of the reduced amplifier with DGS is quite similar to that of the basic amplifier, even though the series microstrip lines with DGS are much smaller than those of the basic amplifier by 53.8% and 55.6% at input and output matching networks, respectively.
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Novel 2-D photonic bandgap structure for microstrip lines
V. Radisic, Y. Qian, R. Coccioli et al. · IEEE Microwave and Guided Wave Letters · 1998 · 660 citations