Surface mount microwave package characterization technique

Abstract

We present a plastic package characterization technique using coplanar waveguide to package adapters (CPA) and line-reflect-match (LRM) calibrations. LRM calibrations on off-set CPA standards are employed to de-embed the response of CPA adapters in measured S-parameters. A variety of small shrink outline packages (SSOP) has been characterized to 26.5 GHz using this technique.