Stencil Printing Process Modeling and Control Using Statistical Neural Networks

Abstract

This paper presents a neural network model for the stencil printing process (SPP) in surface-mount technology (SMT) manufacturing of printed circuit boards (PCBs). A practical model description that decomposes the overall steady-state process in independently modeled subspaces is provided. The neural network model can be updated in real-time procuring a method to control the process by dynamically searching the optimal set point of the control variables. The optimization is performed by minimizing the weighted mean squared error with respect to the desired solder brick height or volume; furthermore, in the case when multiple solutions exist, the set point that yields the lowest variance is used. The process simulator is mainly suitable for offline testing and debugging of more complex closed-loop control algorithms for the SPP optimization providing a common and realistic framework for algorithm performance evaluation. An important consideration in this paper is based on the fact that the estimation of the sampled moments of the probability distributions is made using a statistically significant number of data samples from each board, for each component type, for each printing direction, and for each pad orientation.