Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices

Abstract

The effect of bonding-wire compensation on the capacitances of both the submount and the laser diode is demonstrated in this paper. The measured results show that the small-signal magnitude-frequency responses of the TO packaged laser and photodiode modules can be improved by properly choosing the length of the bonding wire. After packaging, the phase-frequency responses of the laser modules can also be significantly improved. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 76–79, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21266