Thermal analysis of high-power modules

Abstract

A highly descriptive method for displaying heat flow in power modules is presented. Heat flow is studied for three different transistor-stack types: direct bond copper (DEC), thick-film printed substrate, and insulated metal substrate (IMS). DEC and thick film are thermally superior to IMS, but IMS shows potential. In addition, the effect of case-to-sink interface conductivity on heat flow is studied and shown to be of extreme importance in a proper thermal simulation.