On-Chip Electrical Breakdown of Metallic Nanotubes for Mass Fabrication of Carbon-Nanotube-Based Electronic Devices

Abstract

A mass fabrication scheme for carbon-nanotube (CNT)-based electronic devices is developed by combining the semiconductor wafer electrical sorting with selective burning of metallic CNT wires. By applying a millisecond electrical pulse to CNTs with the optimized logical scheme of voltage stress, we successfully removed the metallic CNTs but not the high-performance semiconductor CNTs. The fabrication scheme implemented with a probe card achieved a 100 % gross yield of CNT-based sensors with a short process time.