High‐Density Soft‐Matter Electronics with Micron‐Scale Line Width

Abstract

A method to produce soft and stretchable microelectronics composed of a liquid-phase Gallium-Indium alloy with micron-scale circuit features is introduced. Microchannels are molded onto the surface of a poly(dimethylsiloxane) (PDMS) elastomer and filled with EGaIn using a micro-transfer deposition step that exploits the unique wetting properties of EGaIn in air. The liquid-filled channels function as stretchable circuit wires or capacitor electrodes with a 2 μm linewidth and 1 μm spacing.