Wave model solution to the ground/power plane noise problem

Abstract

In this paper, we describe the development of a theoretical field-based or "wave" model which we are employing in an attempt to characterize the ground/power plane (e.g., the V/sub cc/ plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>