IEEE Transactions on Instrumentation and Measurement · 1995 · 171 citations · 3 references
EngineeringComputer EngineeringElectrical EngineeringCircuit TheoryMicroelectronicsMicrowave EngineeringDevice SimulationElectric CircuitsMicrowave Noise AnalysisNoise In Electronic DevicesPropagation ModelingTransmission LinesElectric Circuit ModelsElectromagnetic-circuit Co-simulationGround Plane EffectsMicrowave Circuit ModelingMultichip ModulesNoise-induced PhenomenaWave Model
In this paper, we describe the development of a theoretical field-based or "wave" model which we are employing in an attempt to characterize the ground/power plane (e.g., the V/sub cc/ plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Methods of Theoretical Physics
Philip Μ. Morse, Herman Feshbach, E. L. Hill · American Journal of Physics · 1954 · 13.3K citations