Publication | Closed Access
Expanded Thermal Model for IGBT Modules
16
Citations
10
References
2006
Year
Heat Dissipation ProblemsElectrical EngineeringEngineeringAnalytical Thermal ModelEnergy EfficiencyThermal ModelIgbt ModulesThermal TransportThermal ManagementComputer EngineeringThermal AnalysisThermal ModelingThermodynamicsPower ElectronicsHeat TransferThermal Engineering
Heat dissipation problems with simultaneous heat generation in IGBT modules are calculated and simulated based on two developed thermal models. One is the analytical thermal model, which is based on Fourier series method. The other is a finite difference model, which relies on the numerical solutions method. The result of two models has been compared. The difference between them has been illustrated and more reliable model has been chosen for more complicate thermal calculation. In order to achieve more accurate temperature distribution, transient thermal response of certain IGBT module has been simulated with extended thermal models
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